MOBIX LABS, INC

Mobix Labs, Inc., filing under the ticker CLAY, is the semiconductor and wireless technology company that emerged from the de-SPAC merger of Chavant Capital Acquisition Corp., a blank-check vehicle sponsored by Chavant Capital Partners LLC that completed its initial public offering in 2021. Focused on millimeter-wave chipsets and related solutions for 5G communications, the combined company filed a Form 10-Q with the SEC on May 15, 2023, reflecting its status as a post-merger operating entity. Mobix Labs targets the global market for advanced wireless connectivity components used across infrastructure and consumer device applications. Sign up at SpacDesk for full filing history, transaction analytics, and real-time data on Mobix Labs and the broader SPAC universe.