Mobix Labs, Inc., trading under the ticker CLAY on Nasdaq, is a fabless semiconductor company specializing in millimeter-wave and radio-frequency integrated circuits targeting 5G wireless infrastructure and communications applications. The company reached public markets through a business combination with Chavant Capital Acquisition Corp, a blank-check company sponsored by Chavant Capital Partners, LLC, which completed its IPO in 2021. The 10-Q filing dated August 16, 2022, bearing accession number 0001410578-22-002649, reflects the company's reporting obligations during the technology sector de-SPAC process. Mobix Labs operates within the semiconductor and advanced wireless technology industry. For complete filing history, deal timelines, and real-time SPAC data on CLAY and hundreds of other transactions, sign up for full access at SpacDesk.