MOBIX LABS, INC

MOBIX Labs, Inc. (Nasdaq: CLAY) is a fabless semiconductor company specializing in millimeter-wave connectivity chipsets for 5G and next-generation wireless applications. The company went public through a business combination with Chavant Capital Acquisition Corp., a blank-check company sponsored by Chavant Capital LLC that completed its SPAC IPO in 2021 on Nasdaq targeting the technology and semiconductor sector. The de-SPAC transaction closed in late 2023, and CLAY has since traded as a post-combination public company. The May 7, 2026 Form 424B3 filing reflects continued post-merger prospectus activity. Sign up at SpacDesk for full filing history, deal timelines, and analytics on CLAY and hundreds of other SPAC transactions.