MOBIX LABS, INC

Mobix Labs, Inc. (Nasdaq: CLAY) is a semiconductor and wireless connectivity company that went public through a business combination with Chavant Capital Acquisition Corp., a blank-check company sponsored by Chavant Capital Partners LLC that completed its IPO in 2021. Chavant Capital targeted the technology sector and finalized its de-SPAC merger with Mobix Labs in 2023. On June 22, 2026, Mobix Labs filed a Form S-1 registration statement with the SEC under accession number 0001493152-26-029436, representing the latest filing activity in the company's post-merger capital markets program. To access the full filing history, sponsor details, and deal data for CLAY, sign up for complete coverage at SpacDesk.